TechNexion Company overview and Product introduction at Embedded World 2016
Speaker: Florian Wohlrab, TechNexion
Introduction of TechNexion, the manufacturer of embedded and industrial Modules and Systems. Technical Sales Manager Florian Wohlrab will first give an overview about TechNexion as a Company, talking about having everything in-house from HW R&D over Software R&D to production and Quality Department. Also highlighting the ODM and EMS capabilities thanks to own high-end manufacturing lines.
The second part of the Video is a Product introduction starting with the new TEK-Series BoxPC which features NXP i.MX6/i.MX7 or Intel Braswell, based on a modular approach. Then the TEP-Series is introduced which is a HMI ranging from 7” to 10.1” to 15” which features same capabilities as the TEK-Series. Following is an overview about the EDM Module Series which is an Open Source Industry Standard based on the MXM3.0 Connector and where TechNexion offers a wide variety of Modules scaling from Solo up to Quad core based on NXP i.MX6 and i.MX7 at the moment. Last but not least the PICO Modules are introduced which are with only 36mm x 40mm are the smallest Modules from TechNexion. They feature on-board eMMC or SD-Card, on-board WiFi/Bluetooth and ranging from NXP i.MX6 UltraLite to Solo, DualLite up to Quad.
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