RTSoft – Software for Intelligent Things
Speaker: Hubert Hafner, RTSoft
We are experts in making your „thing“ intelligent: from hardware enabling to middleware and glue logic programming up to frontend engineering. We offer development services, consuling for Embedded/Industrial Software and IoT Solutions.
Links to more information:
Latest Webinars, White Papers & more
With the IoT, multiple applications across multiple industries can share and exchange data across different types of networks. In addition, every single device and sensor is potentially exposed. In other words, with IoT technologies, the surface of attack explodes and must be addressed holistically.
The integrity of embedded systems can be ensured through the use of cryptographic methods in a clearly defined process and a secure hardware device for key management and state storage. The Kontron Security Solution is a holistic hardware based security solution that provides customers with the ability to address security needs at the application layer.
This 30-page practical book about reed relays aimed at engineers. It requires little or no theoretical knowledge about the materials they are constructed from, all the issues are dealt with in a practical manner.
This webinar from Nexperia Logic will show design engineers how and where to use dual PCB configurable logic.which combines two configurable logic devices in a single package with up to 49 different configuration options available in one package.
Many industries benefit from, if not require, rugged electronics. Military and industrial use is obvious, but professionals in medical, oil and gas, science, transportation, and other industries also need hardware that stands up to punishing situations. Learn more about rugged embedded computing it in this white paper.
This webinar will review the design of the DC link System using optimized solutions based on integrated capacitor-busbar technology which offers lower total system cost and increased power density for applications in traction drive inverters and inverter systems for solar and wind power.
Cree’s bright advantage in horticulture lighting ables lighting manufacturers to best achieve the benefits that LEDs bring to horticulture.
Join this webinar to learn about why to use modular systems in several applications, see what the key drivers for modular designs are and get a comparison of the 3 major open standards for Computer-on-Modules: COM Express, SMARC and Qseven.
Smart grids use phasor measurement units (PMUs) to assess and manage independently operated grid systems. NI, HP, and OSIsoft created a smart grid platform that includes flexible PMUs and phasor data concentrators. Check out how it provides deeper, faster insight into grid issues.
Few companies have expertise in both embedded design and Big Data—or know how to combine these domains. The Advantech IoT Gateway Starter Kit simplifies matters. Find out how this gateway comes preloaded with cloud connectors and a drag-and-drop interface that powers sophisticated data analytics.
For a long time now, many product or device-oriented companies have been attempting to shift the primary focus of their business from shipping hardware to delivering the value and services customers demand today. The success of this approach typically involves a transition to new business models that rely more heavily on software to help cultivate customer relationships and future-proof business processes.
Smart railways require smart control and management systems that must often meet the highest safety requirements up to SIL 4. With SIL pre-certified modular COTS platforms such systems can be developed faster and more cost-effectively than ever. menTCS, the train control system from MEN Mikro Elektronik, is the world's first modular development kit to meet rail safety specifications.
During this webinar we will explain you the use of CoolMOS CE in lighting applications, which helps you to save cost and enables a short design time. You will learn what CoolMOS CE is about, how CoolMOS CE helps to achieve cost-savings, efficiency improvements, PCB size reductions, etc.
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