Low power, low cost & worldwide connectivity for IoT devices by Sigfox
Speaker: Aurelius Wosylus, Sigfox
Sigfox the provider of global, lowest power and lowest cost IoT wireless network is expanding to the German region and expands network coverage in 2016. The new opened Munich office will support local partners and customers building and reselling Sigfox connected devices. In this interview Aurelius Wosylus of Sigfox Germany explains the challenges in the IoT market and how Sigfox is well positioned to help device builders to be successful in their IoT market vertical.
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Standards like COM Express exist for making customer-specific small form factor solutions. These are used to reduce the user‘s development time and costs. Is it possible to reduce the user‘s development costs even further? This white paper describes how this can be done with a modular approach to the carrier, enclosure and cooling using pre-qualified components.
In device development, UL standards increasingly have to be taken into consideration. This whitepaper provides important information on simplified device design according to UL 600V.
Operating temperature fluctuations in medical diagnostic and analytical instrumentation equipment can significantly affect the test results and shorten the life of reagents or samples. The use of space-saving thermoelectric assemblies can solve this problem and provide temperature stability and condensation protection for analytical and medical instrumentation.
In this webinar, you will get an overview of the different cooling technologies for power semiconductor devices. The benefits and drawbacks of each technology will be highlighted in order to provide guidance for the selection of the best one for your application.
In this webinar about High-Power Charging solutions for the future of e-mobility you will learn about: Application trends in DC-EV-Charging, why battery charging seems to remain the most efficient solution and about the difference between AC- and DC-Charging.
Thermal management of medical imaging systems is more challenging than ever. Given the complexity of some PET and SPECT systems, the use of a custom designed liquid cooling systems with plug-and-play components may be a good solution.
Today’s state of the SiC MOSFET indicates resolution on major commercial impediments including price, reliability, ruggedness, and diversification of suppliers. In spite of a price premium over Si IGBTs, the SiC MOSFET has already seen success due to cost-offsetting system-level benefits; the market share for this technology will increase sharply over the next few years as materials costs fall.
The Flash market prepares to standardize on new low-voltage ICs. In this webinar you will learn about Winbond’s high-performance serial Flash ICs that operate from supply voltages as low as 1.2V.
Selecting the right coding standard is an essential building block for safe and secure coding. This white paper looks more closely at the details that need to be considered so that the coding standard chosen is fit for purpose.
Winbond’s ultra-low voltage serial NOR Flash memory can work between 1.14V to 1.60V, which covers most of the single AA battery operation voltage range. The lower Vcc can reduce the power consumption in read operation, improve the system BOM cost and reduce the noise coupling in data bus.
Many companies do not want to see their entire production data and know-how to be stored and processed outside the companies’premises. The proven solution to this challenge are approaches like edge and fog computing. In this webinar you will learn how modular systems based on the well-established and tested COM Express modules provide an efficient solution.
This webinar will review laminated busbar designs and advise some techniques on how to optimize design by avoiding common mistakes. The webinar is beneficial for mechanical and electrical engineers involved in developing inverters, battery systems and other critical applications.
Supporting safety critical applications is at the core of car-to-car communication, and for years, the technology of choice has been IEEE802.11p. Recently, a new standard has started evolving: LTE-V2V. This White Paper compares the two standards on which the safety of millions of road users will depend on.
In this webinar we discuss three TI reference designs that help designers create smart technology that can be integrated into smart home ecosystems. These designs are easy to retrofit into existing homes.
This webinar will show how the Ada language can help you design, implement and verify embedded software that will be reliable, safe and secure, while still meeting its performance requirements.
This webinar will show how advanced magnetic components help to realize product safety, reliability and high performance for the evolving electric vehicle charging infrastructure. The focus will be on all relevant EV charging modes covering AC charging via IC-CPD or wall box (Modes 2 & 3), as well as DC fast charging (Mode 4) and Inductive charging.
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