SECO IoT roadmap: from the proof of concept to the market

Speaker: Gianluca Venere, SECO

During Embedded World 2017 Gianluca Venere, SECO Director of Global Sales, leads us to discover the company's Industrial IoT roadmap showcased at SECO's main booth, along with the latest UDOO solutions able to bring Makers creations from the proof of concept to industrial mass production, at the SECO Lab booth.

SECO’s broad range of Intel®-based solutions are highlighted, from the state-of-the-art and fully scalable embedded solutions based on the Intel® Atom™ E39xx family (formerly "Apollo Lake") in Qseven, eNUC and SMARC form factors, to the ultra low power Intel® Curie™ based solutions and surprising demonstrations. Gianluca Venere also explains the latest and future AMD-based developments, such as the new COM Express™ Type 6 with the AMD Embedded G-Series SoC J Family (formerly “Prairie Falcon”), and SECO’s roadmap from NXP i.MX 6 to i.MX 8M, being one of the early access partners working with NXP on the i.MX 8 and i.MX 8M.

Finally, he presents SECO's new ARMv8 embedded solutions, introducing the first prototype of the AXIOM European project’s programmable hybrid ARM/FPGA solution based on Xilinx® Zynq® Ultrascale +™ MPSoC, as well as the SMARC 2.0 module built for the industrial market from the AXIOM experience and, last but not least, SECO’s connectivity oriented embedded NUC™ with the Qualcomm® Snapdragon™ 410E.

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